Implementasi Lean Six Sigma untuk Optimalisasi SMT: Studi Kasus Solder Tidak Cukup pada PCB Melengkung
DOI:
https://doi.org/10.25170/jpk.v2i2.6176Keywords:
Kaizen, flexible packaging company, improveAbstract
This research aims to optimize Surface Mount Technology (SMT) processes by addressing solder issues on warped printed circuit boards (PCBs). Warped PCBs were identified as a key factor affecting solder quality, impacting product connectivity and reliability. Using Lean Six Sigma, root causes such as printer machine settings, mechanical stress, and PCB material quality were identified. Solutions like adjusting process parameters and controlling material quality reduced the solder defect rate by 94.51%. This study highlights Lean Six Sigma’s effectiveness in improving SMT process efficiency and soldering quality, particularly for curved PCBs. Adding vertical Kapton tape and adjusting squeegee pressure and paste thickness further enhanced solder quality.
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